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Semiconductor Packaging Process Engineer

  • Location: Lincoln, Lincolnshire
  • Sector: Process Control Technical, Semiconductor
  • Job type: Permanent
  • Job reference: NAD618124
  • Salary: 50000

Job description

We are currently seeking Semiconductor Packaging Process Engineers to work for a global leader in the design and development of bespoke electronic applications. This organisation serves into the Automotive, Rail and Renewable Energy markets.

This Semiconductor Packaging Process Engineer job is based in Lincoln, Melton Mowbray, Gainsborough, Nottingham, Newark on Trent, Scunthorpe, and Doncaster.

The Semiconductor Packaging Process Engineer job is a permanent position.

Responsibilities of the job include, but are not limited to:

> Undertake project related activities as a project-team member with a focus on IGBT Power Module Packaging, research computer simulation, experimentation, design, testing and documentation.
> Capable of carrying out research to an internationally recognised standard

The ideal candidate for this Semiconductor Packaging Process Engineer job will ideally have the following experience:

> Bachelors and Master's degree in a science or engineering subject.
> PhD degree in one of the following; Physics, Chemistry, Mechanical Engineering, Electrical and Electronic Engineering, Materials Science.

This organisation heavily invests in their employees and are seeking ambitious individuals that can progress their career with the business.

APPLY NOW for the Semiconductor Packaging Process Engineer job, Lincolnshire by sending your CV and Cover Letter to ndrain@redlinegroup.Com. Alternatively please call 01582878837

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